PACKAGE-ON-PACKAGE (POP) UNDERFILL PROCESS USING A MATERIAL DAM METHOD

Recent developments in the electronics industry have introduced a multi-stack ball grid array (BGA) to meet growing consumer demand for both high-performance and smaller-sized chip packages. This study focused on preliminary of Package-on-Package (PoP) underfill process using material dam method. High viscosity type is considered process. In current experimental work, L path-dispensing method was chosen due its advantages, as reported previous work. The used prevent from moving backwards flowing out dispensing region. built surrounding PoP package. effectiveness analyzed based cycle time lateral lapping, which are significant factors selection. results revealed that slow flow may cause quickly harden while still running. situation restricts creates voids successfully enhanced underfilling layers 3 4 stacked-package. expected provide stacking package useful reference engineer microelectronics industry.